NB5000 – Precise Cutting and Observation Tool

Allows for site-specific analysis, deposition, and removal of material in the micron and submicron range.

  • Ultrahigh performance FIB
    • Ga FIB optics
    • > 50 nA max. beam current at 40kV
  • Integrated Micro-sampling system
    • Fully integrated lift-out system
    • Absorbed current imaging
  • High precision end-point detection
    • Mill & Monitor
    • Section-view
    • Live Fabrication
  • High Resolution SEM
    • 1.5 ┬ánm @ 5kV, at Cross-point
    • 1.0 nm @ 15kV, at Cross-point
    • 0.8 nm @ 30kV, at Cross-point
  • Holders compatible with TEM/STEM
    • Side entry stage


i-beam:
40-2.0 kV, <5nm spot size
(+) machine/deposit
(-) implantation/damage (not ideal for imaging)

e-beam:
30-0.5kV, 0.8nm spot size
(+) no implantation/damage (ideal for imaging)
(-) slow machining/deposition

e-beam + i-beam = dual beam
i-beam is 58 deg. from e-beam
(+) e-beam images of the FIB prepared cross-section face without moving the stage!
(+) serial sectioning for 3D info. = “slice + view”
(-) very complicated/expensive

“Creating partnerships for innovative research”

Ontario Centre for the Characterisation of Advanced Materials